Jingtian & Gongcheng Advises Advanced Semiconductor Engineering on CNY 650 Million Bond Issuance
Date：2011-09-20
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September 20, 2011, Advanced Semiconductor Engineering Inc. (ASE) issued CNY 650,000,000 bonds in Hong Kong.
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test and a leading provider of a comprehensive range of advanced IC Packaging.
Jingtian & Gongcheng acted as the issuer's lawyer.
